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March 2015

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Subject:
Re: BTC with Power Pad
From:
Ben Jordan <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Mon, 2 Mar 2015 08:53:44 -0800
Content-Type:
text/plain
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text/plain (64 lines) 
I think the person to ask is Rainer Taube [log in to unmask] as it
came up in his presentation that manufacturers keep deviating from the
standard packages particularly with regards to heatsink pads.

On Mon, Mar 2, 2015 at 8:49 AM, Jack Olson <[log in to unmask]> wrote:

> I may have misunderstood, but I thought I heard someone at the APEX
> conference imply that it was not a good practice to tie GROUND PINs of
> "Bottom Terminated Components" directly to the grounded THERMAL PAD
> underneath the device.
> Did I hear that right?
> I should have asked when I had the chance, but I got distracted.
>
>
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-- 
*Benjamin W. D. Jordan, *BEng Hon. I (CompSys), Product Manager
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