I suspect the question comes from concerns about solder wicking and heat
flow during assembly - attaching the GND pin directly to the HS pad may
cause cold joints in some cases as too much heat may get sucked into the
big pad. Not sure though as heat flow is not my strong point ;-)
On Mon, Mar 2, 2015 at 10:00 AM, James Jackson <[log in to unmask]> wrote:
> I didn't attend APEX, so my opinion is not worth much but...
>
> I always thought that it was up to the manufacturer of the part in
> question to say how to connect the heat slugs under their parts.
>
> Some will say to not connect them to GND - others will say to connect them.
>
> I realize that your point is about connecting the heat slugs directly to a
> pin that is also GND, but I figure that if they didn't want the slugs
> connected to a GND pin, they would also say that in their datasheets.
>
> But... what do I know...
>
> Regards,
>
> James Jackson
> Oztronics
>
>
>
> On 2015-03-02 10:49, Jack Olson wrote:
>
>> I may have misunderstood, but I thought I heard someone at the APEX
>> conference imply that it was not a good practice to tie GROUND PINs of
>> "Bottom Terminated Components" directly to the grounded THERMAL PAD
>> underneath the device.
>> Did I hear that right?
>> I should have asked when I had the chance, but I got distracted.
>>
>>
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