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Reply To: | (Designers Council Forum) |
Date: | Mon, 2 Mar 2015 12:00:30 -0600 |
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I didn't attend APEX, so my opinion is not worth much but...
I always thought that it was up to the manufacturer of the part in
question to say how to connect the heat slugs under their parts.
Some will say to not connect them to GND - others will say to connect
them.
I realize that your point is about connecting the heat slugs directly
to a pin that is also GND, but I figure that if they didn't want the
slugs connected to a GND pin, they would also say that in their
datasheets.
But... what do I know...
Regards,
James Jackson
Oztronics
On 2015-03-02 10:49, Jack Olson wrote:
> I may have misunderstood, but I thought I heard someone at the APEX
> conference imply that it was not a good practice to tie GROUND PINs of
> "Bottom Terminated Components" directly to the grounded THERMAL PAD
> underneath the device.
> Did I hear that right?
> I should have asked when I had the chance, but I got distracted.
>
>
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