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| Date: | Thu, 19 Mar 2015 11:01:50 -0700 |
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hi all i m an israeli consultant and who guide PCB & Board Designers to use teardropes anywhere. Rigid as Flex. due to using hidensity BGAs the pads are too small so must use it plus SM over pad.
this week at Santa Clara IEEE EMC&Signal Integrity Symp.
next week 23-27 lecturing 5 days at intel SC the Seminar PCB Design for Signal&Power& EMC integrity.
will be happy anyone here.
Shlomo Zigdon. IPC2221 PCB Design IPC2226 HDI . IPC2251 Hispeed Design Std.s Task Member
נשלח מסמארטפון ה-Samsung Galaxy שלי.
-------- הודעה מקורית --------
מאת: "Jenkins, Jeffrey A @ CSG - LINKABIT" <[log in to unmask]>
תאריך:2015/03/19 8:26 AM (GMT-08:00)
אל: [log in to unmask]
עותק:
נושא: Re: [DC] Question of the Week - Teardropping
I add it by default on pretty much every design. The software generally makes it pretty easy and it's a simple way to add robustness to the trace/via interface and helps reduce breakout. During the DRC of the design, some of them I have to adjust slightly, but that is typically minor.
Best Regards,
-Jeffrey
Jeffrey A. Jenkins CID+,CIT
Senior PCB Staff Designer || L-3 Linkabit || Ph: 858-552-9832 || [log in to unmask]
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, March 18, 2015 11:18 AM
To: [log in to unmask]
Subject: [DC] Question of the Week - Teardropping
INFORMAL POLL:
How many of you designers routinely add teardropping or keyholing or
snowmans(?)
or any other form of copper "pad to trace" fillet to your conductive layers?
(I would also be interested to know how many DON'T, if you are brave enough to confess in public...)
thanks,
Jack
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