Hello, Arnaud
What you are looking for is IPC-4761, Via Hole Integrity, or protection.
And the test documents are:
IPC-TM-650 method 5.5.4.9, IPC-TM-650 method 5.5.4.15, and IPC-TM-650 method 5.5.4.17, one of which is the resistivity test method.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of GRIVON Arnaud
Sent: Monday, March 16, 2015 11:44 AM
To: [log in to unmask]
Subject: [TN] Test Method for Via Plating Integrity & Gold Embrittlement Calculator

Hello,

Not a good practice, but I am merging here two different pending questions I have...
I am currently looking for the following :

1.       Is there any IPC document addressing the via/hole plating integrity?

I seem to remind an IPC TM-650 document with a criterion on the via resistance after a defined thermal cycling test (less than +/- xx% of the initial resistance). I came across it before IST, so it was not this one...



2.       An Excel spreadsheet enabling the calculation of the gold percentage within a solder joint.

Something was shared over TechNet some years ago, but I did not manage to find it.



Thanks in advance for your help.

Best regards,

Arnaud Grivon

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