TECHNET Archives

February 2015

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Tue, 3 Feb 2015 08:12:52 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (38 lines)
On Tue, Feb 3, 2015 at 2:31 AM, lyonyuan <[log in to unmask]> wrote:

> DDR4 socket


Hi Lyonyuan,

It would help to know what the DDR4 Socket actually is. Since the socket is
not mating with anything else other than the memory module, there really is
no maximum gap defined. Per IPC-A-610F section 7.1.8, the defects are:

-Will not mate when used in application due to angle or misalignment.
-Component violates height requirements.
-Board lock is not fully inserted/snapped into board.
-Lead protrusion does not meet acceptance requirements.

Note: A trial mating of connector to connector or to assembly may be
required to assure the connectors meet form, fit and function requirement.

Steve

-- 


This email and any attachments are only for use by the intended 
recipient(s) and may contain legally privileged, confidential, proprietary 
or otherwise private information. Any unauthorized use, reproduction, 
dissemination, distribution or other disclosure of the contents of this 
e-mail or its attachments is strictly prohibited. If you have received this 
email in error, please notify the sender immediately and delete the 
original. 


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2