Dale,
Many years ago I ran across a batch of 0805 caps that were forming solder balls at the package/end cap interface. It turned out the part should have been soldered internally with a high temp alloy but, for whatever reason, Sn63 was used in this particular batch (operator error?). This caused the internal solder to melt, expand and escape which looked like it was the assembly soldering process that was going awry.
Something to eliminate in your pursuit.
Ed Popielarski
Engineering Manager
970 NE 21st Ct.
Oak Harbor, Wa. 98277
Ph: 360-675-1322
Fx: 206-624-0695
Cl: 949-581-6601
"It's one kind of victory to slay a beast, move a mountain, and cross a chasm, but it's another kind altogether to realize that the beast, the mountain, and the chasm were of your own design."
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dale Ritzen
Sent: Wednesday, February 11, 2015 5:25 PM
To: [log in to unmask]
Subject: [TN] Incursion of fluxes into electronic device packages
Hello Technetters,
Has anyone ever experienced issues with solder paste flux (or potentially flux from cored wire solder or wave solder or selective solder processes) penetrating into a chip package during reflow or cleaning or whatever? One of our customers has asked about it and I know of no incidents like this. Their question applies to all types of flux in general. But, I thought someone out there may have run across this in their travels.
I'm trying to figure out just how that could possibly happen with all the package retooling for the higher temperature RoHS processes, but I will rely on your vast experience and knowledge to provide the right answers.
I am waiting for all the "It depends..." answers to start rolling in!
Thank you in advance,
Dale Ritzen, ASQ CQA
Quality Manager / ISO Management representative _____________________________ Austin Manufacturing Services
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