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January 2015

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 9 Jan 2015 11:39:51 -0500
Content-Type:
text/plain
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Hi Victor. In general it's one of the three: poor board quality; moisture in the board or thermal abuse.

Regards,

Vladimir

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message  
From: Victor Hernandez
Sent: Friday, January 9, 2015 11:14
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] PWB laminate delamination

Fellow TechNetters:

Where can I find information regarding delamination? Are the laminate material separation artifact of thermal excursion, solder float test, 3x or 6x, differ from that of an exothermic event in which current/heat melts the laminate and/or heat exploded/cracking the laminate.

Victor,


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