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January 2015

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 9 Jan 2015 10:13:27 -0600
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Fellow TechNetters:

   Where can I find information regarding delamination?   Are the laminate material separation artifact of thermal excursion, solder float test, 3x or 6x, differ from that of an exothermic event in which current/heat melts the laminate and/or heat exploded/cracking the laminate.

Victor,


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