My stupidity - I meant < .02 microns. Steve

On 2015-01-19, 12:39 PM, "Wayne Thayer" <[log in to unmask]> wrote:

>Note that +/- 2microns is much thicker than the total plated deposits. If
>you get at least a peak and a valley beneath a wirebond stitch, that
>certainly will cause a bunch of trouble: Totally burning through the peaks
>and not being able to get welds down in the valleys. So it depends on the
>wavelength of the deformations.
>
>IPC cares about soldering, not wirebonding.
>
>Wayne
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
>Sent: Monday, January 19, 2015 12:18 PM
>To: [log in to unmask]
>Subject: Re: [TN] ENEPIG & Gold wire bond
>
>Thanks Steve,
>I have had one complaint that the nickel is too rough - looks like surface
>co-planarity is +/-  2 microns which too me is nothing and from further
>analysis follows the contour of the copper underneath which easily meets
>the
>IPC spec - should this cause an issue? Regards Steve
>
>On 2015-01-19, 11:56 AM, "Steven Creswick" <[log in to unmask]>
>wrote:
>
>>Steve,
>>
>>The short answer is not too much.
>>
>>You should be able to develop a robust bond schedule to the ENEPIG (but
>>I guarantee you that it will be at least somewhat different than your
>>bond schedule to soft gold).  Under no circumstances should you assume
>>that it is a plug and play alternate.
>>
>>You should not have to spec any differences in wire properties.
>>
>>You may look into changing the face angle of your capillary and inner
>>chamfer as part of your qualification testing.  Depending upon your
>>current bonding tool, you may also take a look at increasing the outer
>>radius of the tool.
>>
>>ENEPIG is 'hard' in comparison to pure soft gold, so if currently
>>running with a 15° face angle, look at 8°.  If you have problems with
>>tail formation, you may look into a 120° inner chamfer instead of a
>>90°.  If you are getting a lot of heel breaks at the second bond,
>>increase the outer radius ..... all stuff you most likely are already
>>looking into.
>>
>>Final comments - ENEPIG is not totally without issues.  Some days, some
>>lots, just plain sucked!  There is no other way to say it.  Get a
>>reliable plater.  Work with them.  Stay with them.  Don't let
>>accounting take you to the cheapest place in town - you will regret the
>>grief you will have.
>>
>>NOTHING bonds like clean, pure, soft gold!!!  It IS the Cadillac!
>>
>>
>>Steve Creswick
>>Sr Associate - Balanced Enterprise Solutions
>>http://www.linkedin.com/in/stevencreswick
>>                         616 834 1883
>>
>>
>>
>>
>> 
>>-----Original Message-----
>>From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
>>Sent: Monday, January 19, 2015 11:22 AM
>>To: [log in to unmask]
>>Subject: [TN] ENEPIG & Gold wire bond
>>
>>Hi All,
>>When wire bonding with 1 mil gold wire is their any difference in wire
>>bonding technique on ENEPIG versus electroplated soft gold?
>>Thanks. Steve Kelly
>>
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