Steve,

The short answer is not too much.

You should be able to develop a robust bond schedule to the ENEPIG (but I
guarantee you that it will be at least somewhat different than your bond
schedule to soft gold).  Under no circumstances should you assume that it is
a plug and play alternate.

You should not have to spec any differences in wire properties.

You may look into changing the face angle of your capillary and inner
chamfer as part of your qualification testing.  Depending upon your current
bonding tool, you may also take a look at increasing the outer radius of the
tool.

ENEPIG is 'hard' in comparison to pure soft gold, so if currently running
with a 15° face angle, look at 8°.  If you have problems with tail
formation, you may look into a 120° inner chamfer instead of a 90°.  If you
are getting a lot of heel breaks at the second bond, increase the outer
radius ..... all stuff you most likely are already looking into.

Final comments - ENEPIG is not totally without issues.  Some days, some
lots, just plain sucked!  There is no other way to say it.  Get a reliable
plater.  Work with them.  Stay with them.  Don't let accounting take you to
the cheapest place in town - you will regret the grief you will have.

NOTHING bonds like clean, pure, soft gold!!!  It IS the Cadillac!


Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
                         616 834 1883




 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Monday, January 19, 2015 11:22 AM
To: [log in to unmask]
Subject: [TN] ENEPIG & Gold wire bond

Hi All,
When wire bonding with 1 mil gold wire is their any difference in wire
bonding technique on ENEPIG versus electroplated soft gold?
Thanks. Steve Kelly

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