Hi Steve - yes, when we introduced the ENEPIG surface finish into the WB
process, we had to make some slight process adjustments. Nothing huge but
depending on the type of WB you are doing and your specific equiprment, you
will need to make some minor time/temperature/pressure changes. It is best
to have several extra pwas to use for process parameter trials. Good Luck.

Dave Hillman
Rockwell Collins
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On Mon, Jan 19, 2015 at 10:21 AM, Steven Kelly <[log in to unmask]> wrote:

> Hi All,
> When wire bonding with 1 mil gold wire is their any difference in wire
> bonding technique on ENEPIG versus electroplated soft gold?
> Thanks. Steve Kelly
>
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