Hi Dave,

What about Techspray WSOL mask? I have used it for big heavy SMT power
inductors when they've been on both sides of the board because they've
fallen off once in a while during the second reflow. Haven't used it on
BGA's though...

Steve

On Tue, Dec 9, 2014 at 6:42 AM, David Hillman <
[log in to unmask]> wrote:

> Hi gang - looking for an adhesive suggestion. I have an assembly in which a
> heavy BGA was accidently located on process side one (bottom) so that when
> we reflow process side two (top) the BGA is doing its best to fall off.
> Unfortunately I can't reverse my process order for a couple of reasons so I
> am looking for a temporary fix until I can get the assembly revised. I was
> thinking of using some type of adhesive to temporarily hold the BGA in
> place during reflow - tack down the corners sort of action. Does anyone
> have any adhesive (ideally temporary, water washable/removable) suggestions
> I can investigate?
>
> TIA
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
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