Seems like perfect use for a staking adhesive, except for your strange 
requirement that it be easily removable. Staking adhesives enhance reliability 
by assisting with strengthening the mechanics at the corner balls, and are 
known to increase the resistance to shock loads too.

So if you're stuck with this strange set of requirements, then I doubt you'll 
find something pre-qualified for it. So since qualification is required, 
anything is open game. I'd play with water washable solder masking materials, 
also peelable masking material.

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
Sent: Tuesday, December 09, 2014 8:42 AM
To: [log in to unmask]
Subject: [TN] BGA Reflow Issue

Hi gang - looking for an adhesive suggestion. I have an assembly in which a 
heavy BGA was accidently located on process side one (bottom) so that when we 
reflow process side two (top) the BGA is doing its best to fall off.
Unfortunately I can't reverse my process order for a couple of reasons so I am 
looking for a temporary fix until I can get the assembly revised. I was 
thinking of using some type of adhesive to temporarily hold the BGA in place 
during reflow - tack down the corners sort of action. Does anyone have any 
adhesive (ideally temporary, water washable/removable) suggestions I can 
investigate?

TIA

Dave Hillman
Rockwell Collins
[log in to unmask]


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