Hello Technet,
 
 
Is there a recognized (i.e. IPC or industry) specification for the maximum depth of the "dimple" typically formed in the surface of laser drilled blind plated-over microvias?
 
If not, is there a consensus amongst the group of the maximum depth of a dimple that does not create an assembly issue or a reliability issue with the potential for additional voiding beyond that which is normal for a solder joint?
 
Thanks in advance,
 
Gerry 		 	   		  

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