Hello Technet,

I am looking to understand if there is an IPC standard where is specified 
the minimum number of prepreg foils that should be put between two PCB 
layers.
I know that IPC 6012C (par. 3.6.2.15) specify that the minimum dielectric 
spacing is 90um and that the supplier choice the number of prepreg layers, 
but I was wondering if there are other standards that may specify this 
statement.

I have a case where a Customer is expecting that a minumum of two prepreg 
foils should be put between copper layers.
 
Does anyone know in which IPC standard I can find criteria where is stated 
that a minimum of two prepreg foils should be used and why ? Which 
benefits ?
 
Thanks in advance for your help.

Best Regards
Francesco

Francesco Di Maio 
GEST labs - Via Kennedy Ingresso 2, 20871 Vimercate (MB) - Italy
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