Yes, Joyce is correct about the ESD issue. George is also correct that the marking probably goes deep into the cap.
Bonding any epoxy or ink to the cover does not work, because all you need is a little bit of fine grit emery cloth to remove that and then the hot-stamped markings are visible again.
Even if you successfully bonded something to the cap, I can tell you it is very easy to decap the false cap or X-ray it and identify the component by the die/circuit, if someone really wanted to rev-eng the part.
So the only way to make it more difficult (but never impossible) to identify the component is to decap the IC, pot over the die with a low-outgassing thermally conductive hard epoxy, and recap it with caps from some other IC of the same package. Then when someone attempts to decap it, they typically cannot without destroying the die inside. But this is a very costly process, and not for any newbie.
But I know how...heh heh.
Your friend,
Nodda N. Ewby
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Yuan-chia Joyce Koo
Sent: Wednesday, October 15, 2014 3:17 PM
To: [log in to unmask]
Subject: Re: [TN] Obscure IC part markings
if it is IC, you need globtop epoxy. it designed to put a compressive stress on the IC (with heavily filled fine silica - low
alpha particle type). grinding off the marking is not recommended.
you need to take care of ESD and it is not easy - if it is bare die
(IC) you are talking about.
prevent reverse engineer is a art. the design should be taking into
consideration prior to MFG. ask your designer (customer), they must
have some idea how it should be done... unless you are dealing with newbies... ;-(.
my 1.78 cents.
jk
On Oct 15, 2014, at 3:03 PM, Craig Sullivan wrote:
> I have a customer requirement to "apply an electronics grade epoxy
> over component x that will obscure part the part marking." They are
> trying to prevent reverse engineering of their product. There are of
> course a multitude of epoxies, but dispensing onto small ICs, etc.,
> can be a challenge.
>
>
>
> I know about micro abrasion processes and such but I'm curious how
> others would handle this requirement?
>
>
>
> Craig Sullivan
>
> Manufacturing Engineer / IT Administrator
>
> Phone: +1.607.266.0480 x115
>
> Fax: +1.607.266.0482
>
> Email: <mailto:[log in to unmask]> [log in to unmask]
>
> Web: <http://www.mplinc.com/> www.mplinc.com
>
>
>
> MPL, Inc.
>
> 41 Dutch Mill Road | Ithaca | NY | 14850
>
> P Please consider the environment before printing this e-mail.
>
>
>
> _____
>
> Confidentiality Notice:
> This e-mail contains privileged and confidential information which is
> the property of MPL Incorporated, intended only for the use of the
> intended recipient(s). Unauthorized use or disclosure of this
> information is prohibited. If you are not an intended recipient,
> please immediately notify MPL Incorporated and destroy any copies of
> this email. Receipt of this e-mail shall not be deemed a waiver by MPL
> Incorporated of any privilege or the confidential nature of the
> information.
>
> Export Control:
> This message is intended only for the addressee and may contain
> information that is company confidential or privileged. Any technical
> data in this message may be exported only in accordance with the U.S.
> International Traffic in Arms Regulations (22 CFR Parts 120-130) or
> the Export Administration Regulations (15 CFR Parts 730-774).
> Unauthorized use is strictly prohibited and may be unlawful. If you
> are not the intended recipient, or the person responsible for
> delivering to the intended recipient, you should not read, copy,
> disclose or otherwise use this message. If you have received this
> email in error, please delete it, and advise the sender immediately.
>
>
>
>
>
>
>
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud
> service.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
