if it is IC, you need globtop epoxy.  it designed to put a  
compressive stress on the IC (with heavily filled fine silica - low  
alpha particle type).  grinding off the marking  is not recommended.   
you need to take care of ESD and it is not easy - if it is bare die  
(IC) you are talking about.
prevent reverse engineer is a art.  the design should be taking into  
consideration prior to MFG.   ask your designer (customer), they must  
have some idea how it should be done... unless you are dealing with  
newbies... ;-(.
my 1.78 cents.
                     jk
On Oct 15, 2014, at 3:03 PM, Craig Sullivan wrote:

> I have a customer requirement to "apply an electronics grade epoxy  
> over
> component x that will obscure part the part marking." They are  
> trying to
> prevent reverse engineering of their product. There are of course a
> multitude of epoxies, but dispensing onto small ICs, etc., can be a
> challenge.
>
>
>
> I know about micro abrasion processes and such but I'm curious how  
> others
> would handle this requirement?
>
>
>
> Craig Sullivan
>
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