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October 2014

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From:
"Wenger, George M. [Contractor]" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M. [Contractor]
Date:
Wed, 15 Oct 2014 14:52:41 -0500
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If you try to hide the marking by covering it up with marking ink, paint, epoxy, etc. you could still have a problem with someone who was trying to reverse engineer the product because we've taken components that were cover up and very carefully cross sectioned though the coating and stopped when we got very close to the marking and while it was very difficult and not easy to read we were able to determine what the marking said.  The best way we know is to mechanically grind away the marking and then cover the top of the component with marking ink, paint, epoxy, etc.

Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home  (732) 309-8964 Mobile
E-mail [log in to unmask]
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Sullivan
Sent: Wednesday, October 15, 2014 3:03 PM
To: [log in to unmask]
Subject: [TN] Obscure IC part markings

I have a customer requirement to "apply an electronics grade epoxy over component x that will obscure part the part marking." They are trying to prevent reverse engineering of their product. There are of course a multitude of epoxies, but dispensing onto small ICs, etc., can be a challenge. 

 

I know about micro abrasion processes and such but I'm curious how others would handle this requirement?

 

Craig Sullivan

Manufacturing Engineer / IT Administrator

Phone:  +1.607.266.0480 x115

Fax:  +1.607.266.0482

Email:  <mailto:[log in to unmask]> [log in to unmask]

Web:   <http://www.mplinc.com/> www.mplinc.com

 

MPL, Inc.

41 Dutch Mill Road  |  Ithaca  |  NY  |  14850

P Please consider the environment before printing this e-mail.

 

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