Hello Technet,
I am looking to understand if there is an IPC standard where is specified
the minimum number of prepreg foils that should be put between two PCB
layers.
I know that IPC 6012C (par. 3.6.2.15) specify that the minimum dielectric
spacing is 90um and that the supplier choice the number of prepreg layers,
but I was wondering if there are other standards that may specify this
statement.
I have a case where a Customer is expecting that a minumum of two prepreg
foils should be put between copper layers.
Does anyone know in which IPC standard I can find criteria where is stated
that a minimum of two prepreg foils should be used and why ? Which
benefits ?
Thanks in advance for your help.
Best Regards
Francesco
Francesco Di Maio
GEST labs - Via Kennedy Ingresso 2, 20871 Vimercate (MB) - Italy
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