Hi Mike, This is indeed sad news.  We will always miss Jack's  guidance for moisture sensitivity testing of plastic packages and his sense of humor.  My condolences to Jack's family.


Thank-you
Mumtaz
858-795-0112
Peregrine  Semiconductor


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Buetow
Sent: Monday, September 08, 2014 10:34 AM
To: [log in to unmask]
Subject: [TN] Jack McCullen passed away

Folks,



We lost another of our own last night as Jack McCullen passed away. Jack was instrumental in getting the problems with component package popcorning and delamination recognized and on the books.



When I worked at IPC, I relied heavily on Jack to help get agreement between IPC (which was supported by Intel) and the Jedec specs (which were driven by TI at the time) on the old IPC-SM-786, and later the J-STD-020 and J-STD-033. He always represented Intel and the standards groups he worked with professionally and with dignity. And if you caught him at the right time, he could be really, really funny.



A few more details here:
http://circuitsassembly.com/ca/index.php/news-itemid-fix/24243-component-standards-chairman-mccullen-passes-away



Best,



Mike



Mike Buetow

PCD&F/Circuits Assembly

w/m: 617-327-4702

@mikebuetow



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