another hero of IPC.  Many thanks to McCullen for his contribution to  
the industry.  I always found the Intel packaging handbook is very  
useful and soldering recommendation are second to none.  Please  
accept my condolence.  I am lucky to work in a field that have so  
many gurus guide us... (can't say for the next gen... they might not  
be as lucky as us).
       joyce
On Sep 8, 2014, at 1:33 PM, Mike Buetow wrote:

> Folks,
>
>
>
> We lost another of our own last night as Jack McCullen passed away.  
> Jack
> was instrumental in getting the problems with component package  
> popcorning
> and delamination recognized and on the books.
>
>
>
> When I worked at IPC, I relied heavily on Jack to help get agreement
> between IPC (which was supported by Intel) and the Jedec specs  
> (which were
> driven by TI at the time) on the old IPC-SM-786, and later the J- 
> STD-020
> and J-STD-033. He always represented Intel and the standards groups he
> worked with professionally and with dignity. And if you caught him  
> at the
> right time, he could be really, really funny.
>
>
>
> A few more details here:
> http://circuitsassembly.com/ca/index.php/news-itemid-fix/24243- 
> component-standards-chairman-mccullen-passes-away
>
>
>
> Best,
>
>
>
> Mike
>
>
>
> Mike Buetow
>
> PCD&F/Circuits Assembly
>
> w/m: 617-327-4702
>
> @mikebuetow
>
>
>
> The 2014 CIRCUITS ASSEMBLY *Directory of EMS Companies:*
> circuitsassembly.com/dems
>
>
>
> PCB West: Silicon Valley's largest printed circuit trade show!
>
> Sept. 9-11, 2014  pcbwest.com
>
>
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