Folks,



We lost another of our own last night as Jack McCullen passed away. Jack
was instrumental in getting the problems with component package popcorning
and delamination recognized and on the books.



When I worked at IPC, I relied heavily on Jack to help get agreement
between IPC (which was supported by Intel) and the Jedec specs (which were
driven by TI at the time) on the old IPC-SM-786, and later the J-STD-020
and J-STD-033. He always represented Intel and the standards groups he
worked with professionally and with dignity. And if you caught him at the
right time, he could be really, really funny.



A few more details here:
http://circuitsassembly.com/ca/index.php/news-itemid-fix/24243-component-standards-chairman-mccullen-passes-away



Best,



Mike



Mike Buetow

PCD&F/Circuits Assembly

w/m: 617-327-4702

@mikebuetow



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