May be a stupid question to ask but still curious :
When the CTE of the lmainate is reduced, will it weaken the property of the fibre weave, leading to the manifestation of measling.

Regards,
~wee mei~
________________________________________
From: TechNet [[log in to unmask]] on behalf of Steve Gregory [[log in to unmask]]
Sent: Friday, September 19, 2014 6:53 AM
To: [log in to unmask]
Subject: Re: [TN] Allowable % of Filler in FR-4

Kinda' like this Gregg?

Steve

https://www.youtube.com/watch?v=1SmgLtg1Izw


On Thu, Sep 18, 2014 at 4:20 PM, Gregg Owens <[log in to unmask]> wrote:

> That's a great word to describe IPC meetings "frisky." The word
> "contentious" came to mind, but frisky is more align with cat herding which
> is what happens when you have too many engineers in a room. :-)
>
> Gregg
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
> Sent: Thursday, September 18, 2014 2:20 PM
> To: [log in to unmask]
> Subject: Re: [TN] Allowable % of Filler in FR-4
>
> Does this relate to the new classifications of FR-4?  Have heard there may
> be a pretty frisky IPC 4101 meeting coming in Rosemont.
>
> Denny Fritz
>
>
> -----Original Message-----
> From: Ron Feyereisen <[log in to unmask]>
> To: TechNet <[log in to unmask]>
> Sent: Thu, Sep 18, 2014 5:01 pm
> Subject: [TN] Allowable % of Filler in FR-4
>
>
> Hi Technetters!
>
> Does anyone know if there's an allowable percentage maximum of silica
> filler used in FR-4 PCB material?
>
> "Fillers such as silica and aluminum hydroxide are added to the epoxy
> resin primarily to lower the coefficient of thermal expansion (CTE) of the
> laminate while enhancing the flame retardant ability and reducing material
> cost."
>
> From "Controlling Moisture in Printed Circuit Boards" published in the IPC
> Printed Circuit Expo, APEX & Designer Summit Proceedings
>
> Thanks,
>
> Ron
>
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>

--


This email and any attachments are only for use by the intended
recipient(s) and may contain legally privileged, confidential, proprietary
or otherwise private information. Any unauthorized use, reproduction,
dissemination, distribution or other disclosure of the contents of this
e-mail or its attachments is strictly prohibited. If you have received this
email in error, please notify the sender immediately and delete the
original.


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________