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September 2014

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Fri, 19 Sep 2014 09:15:22 -0500
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Good paper! I didn't have that one in the files and now I do!

Dave

On Fri, Sep 19, 2014 at 8:54 AM, Steve Gregory <[log in to unmask]> wrote:

> Hi Vladimir,
>
> While I don't have any direct experience, I did find this paper that has
> some information if you look on pages 13 & 14. Don't know if you've seen
> this:
>
>
> http://download.springer.com/static/pdf/957/art%253A10.1007%252FBF03214704.pdf?auth66=1411307349_1b796a87f22093a088d7a8178dfff19e&ext=.pdf
>
> Steve
>
> On Fri, Sep 19, 2014 at 7:17 AM, Vladimir Igoshev <
> [log in to unmask]> wrote:
>
> > ‎I'm trying to find information on whether Sn-Bi based solders are
> > susceptible to Au embrittlement in a similar way as Sn and Sn-Pb-based
> > solders do.
> >
> > I don't see why they wouldn't but need some confirmation.
> >
> > As always, thank you very much in advance for constructive answers.
> >
> > Regards,
> >
> > Vladimir
> >
> > Sent from my BlackBerry 10 smartphone on the Rogers network.
> >
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