http://iweb.tms.org/PbF/JOM-0212-45.pdf

On Sep 19, 2014, at 9:54 AM, Vladimir Igoshev wrote:

> Thank you Dave. That's ‎exactly what I thought.
>
> Regards,
>
> Vladimir
>
> Sent from my BlackBerry 10 smartphone on the Rogers network.
>   Original Message
> From: David Hillman
> Sent: Friday, September 19, 2014 9:50 AM
> To: TechNet E-Mail Forum; Vladimir Igoshev
> Subject: Re: [TN] Au embrittlement
>
> Hi Vlad - yes, any Sn based solder would be susceptible to gold  
> embrittlement since the other major element constituents don't  
> specifically participate in the SnAu intermetallic (IMC) reaction.  
> The other elements may inhibit the reaction by being a "more  
> favored" IMC - the presence of copper has been shown to do this.  
> Take a look at Julie Silk's papers at SMTAI 2013 and the paper at  
> SMTAI 2014 in a couple weeks for additional details.
>
> Dave
>
> On Fri, Sep 19, 2014 at 8:17 AM, Vladimir Igoshev  
> <[log in to unmask]> wrote:
> ‎I'm trying to find information on whether Sn-Bi based solders are  
> susceptible to Au embrittlement in a similar way as Sn and Sn-Pb- 
> based solders do.
>
> I don't see why they wouldn't but need some confirmation.
>
> As always, thank you very much in advance for constructive answers.
>
> Regards,
>
> Vladimir
>
> Sent from my BlackBerry 10 smartphone on the Rogers network.
>
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