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September 2014

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 19 Sep 2014 09:54:26 -0400
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Thank you Dave. That's ‎exactly what I thought.

Regards,

Vladimir

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message  
From: David Hillman
Sent: Friday, September 19, 2014 9:50 AM
To: TechNet E-Mail Forum; Vladimir Igoshev
Subject: Re: [TN] Au embrittlement

Hi Vlad - yes, any Sn based solder would be susceptible to gold embrittlement since the other major element constituents don't specifically participate in the SnAu intermetallic (IMC) reaction. The other elements may inhibit the reaction by being a "more favored" IMC - the presence of copper has been shown to do this. Take a look at Julie Silk's papers at SMTAI 2013 and the paper at SMTAI 2014 in a couple weeks for additional details.

Dave

On Fri, Sep 19, 2014 at 8:17 AM, Vladimir Igoshev <[log in to unmask]> wrote:
‎I'm trying to find information on whether Sn-Bi based solders are susceptible to Au embrittlement in a similar way as Sn and Sn-Pb-based solders do.

I don't see why they wouldn't but need some confirmation. 

As always, thank you very much in advance for constructive answers.

Regards,

Vladimir

Sent from my BlackBerry 10 smartphone on the Rogers network.

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