Yes. Too many egos in one room, and the ones that really know their sh!t are the quiet ones who are taking it all in with a good mix of moderation and sensibility.

And remember; in the history of every great project there comes a time when one must shoot the engineers and start production, and the loudest ones are led outside first.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Owens
Sent: Thursday, September 18, 2014 5:20 PM
To: [log in to unmask]
Subject: Re: [TN] Allowable % of Filler in FR-4

That's a great word to describe IPC meetings "frisky." The word "contentious" came to mind, but frisky is more align with cat herding which is what happens when you have too many engineers in a room. :-)

Gregg 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Thursday, September 18, 2014 2:20 PM
To: [log in to unmask]
Subject: Re: [TN] Allowable % of Filler in FR-4

Does this relate to the new classifications of FR-4?  Have heard there may be a pretty frisky IPC 4101 meeting coming in Rosemont. 
 
Denny Fritz
 
 
-----Original Message-----
From: Ron Feyereisen <[log in to unmask]>
To: TechNet <[log in to unmask]>
Sent: Thu, Sep 18, 2014 5:01 pm
Subject: [TN] Allowable % of Filler in FR-4


Hi Technetters!

Does anyone know if there's an allowable percentage maximum of silica filler used in FR-4 PCB material?

"Fillers such as silica and aluminum hydroxide are added to the epoxy resin primarily to lower the coefficient of thermal expansion (CTE) of the laminate while enhancing the flame retardant ability and reducing material cost."

From "Controlling Moisture in Printed Circuit Boards" published in the IPC Printed Circuit Expo, APEX & Designer Summit Proceedings

Thanks,

Ron



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