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September 2014

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Thu, 18 Sep 2014 16:52:45 -0600
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Kinda' like this Gregg?

Steve

https://www.youtube.com/watch?v=1SmgLtg1Izw


On Thu, Sep 18, 2014 at 4:20 PM, Gregg Owens <[log in to unmask]> wrote:

> That's a great word to describe IPC meetings "frisky." The word
> "contentious" came to mind, but frisky is more align with cat herding which
> is what happens when you have too many engineers in a room. :-)
>
> Gregg
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
> Sent: Thursday, September 18, 2014 2:20 PM
> To: [log in to unmask]
> Subject: Re: [TN] Allowable % of Filler in FR-4
>
> Does this relate to the new classifications of FR-4?  Have heard there may
> be a pretty frisky IPC 4101 meeting coming in Rosemont.
>
> Denny Fritz
>
>
> -----Original Message-----
> From: Ron Feyereisen <[log in to unmask]>
> To: TechNet <[log in to unmask]>
> Sent: Thu, Sep 18, 2014 5:01 pm
> Subject: [TN] Allowable % of Filler in FR-4
>
>
> Hi Technetters!
>
> Does anyone know if there's an allowable percentage maximum of silica
> filler used in FR-4 PCB material?
>
> "Fillers such as silica and aluminum hydroxide are added to the epoxy
> resin primarily to lower the coefficient of thermal expansion (CTE) of the
> laminate while enhancing the flame retardant ability and reducing material
> cost."
>
> From "Controlling Moisture in Printed Circuit Boards" published in the IPC
> Printed Circuit Expo, APEX & Designer Summit Proceedings
>
> Thanks,
>
> Ron
>
>
>
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