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Subject:
From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Wed, 6 Aug 2014 19:41:45 +0000
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https://www.google.com/url?q=http://www.mate.tue.nl/~piet/dat/sol/pdf/rues03prA42.pdf&sa=U&ei=3YTiU6f0F4SBogSntoKwDA&ved=0CAcQFjAC&client=internal-uds-cse&usg=AFQjCNFbkjdTEN5nkbT9_QDYl41-DsAgGw


Ed Popielarski
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Wednesday, August 06, 2014 12:11 PM
To: [log in to unmask]
Subject: Re: [TN] SJ fracture signature

Newbie Question:

 Why do the images look like vanilla ice cream with cookie crumbs?  

 Why the very inconsistent mixture in the solder?  At first I thought it was just some coloring issue but the cracks seem to propagate along the interfaces.

I would think the solder would be a better amorphous mixture. Could that solder filled with dross?
 
Bob K.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Wednesday, August 06, 2014 2:49 PM
To: [log in to unmask]
Subject: [TN] SJ fracture signature

We see hundreds of cracked solder joints every year, but I can't say that I've ever seen one quite like this.  I have some suspicions, but I'll keep them to myself, as to not prejudice the crowd.
EDS maps are forthcoming.

This is a caught in-the-wild field failure of a 48-pin BGA Reballed to SnPb ENIG on board side Ni barrier on component side

http://stevezeva.homestead.com/45268-1.JPG

http://stevezeva.homestead.com/45268-2.JPG

http://stevezeva.homestead.com/45268-8.JPG

Thoughts?  And Thanks to Steve!


Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.


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