Hi All,

We have a few customers asking for 6x solder float at 288°C, 10 seconds
(IPC-TM-650, 2.6.8, Condition A). After completion of 6x solder float (using
SnPb 63/37 solder) we typically see reduction of Copper in PTH (due to
copper dissolution) in the range of 20 to 25µm. The reduction in Cu
thickness is maximum at the PTH knee area.

Can I have some inputs if this level of copper dissolution is normal?
If it is not normal, how do we reduce this?

Thanks in advance!

Best Regards,
U.Nagaraj
MICROPACK, India.
[Logo]<http://www.micro-pack.com>

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