agree with steve 100%.  It also depend upon your assembly condition:  
flux activity, number of reflow, reflow profile, subsequent exposure  
to environment.... your design group should pick and choose the right  
finishing... not on the MFG floor... my 2 cents.
                 jk
On Aug 15, 2014, at 1:55 PM, Stephen Gregory wrote:

> To add to Wayne's input, make sure you call out the right OSP  
> depending on the board technology...not all OSP's are the same.
>
> Steve
>
> Sent from my BlackBerry 10 smartphone.
>   Original Message
> From: Wayne Thayer
> Sent: Friday, August 15, 2014 11:28 AM
> To: [log in to unmask]
> Reply To: TechNet E-Mail Forum
> Subject: Re: [TN] surface finish for "bare" copper
>
> OSP
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Mark Larson
> Sent: Friday, August 15, 2014 1:12 PM
> To: [log in to unmask]
> Subject: [TN] surface finish for "bare" copper
>
> Hi,
>
> I've got a board that needs bare copper, many years ago I had this  
> as well and
> seem to recall that they can put on some kind of finish in the  
> process that
> does not leave it bare, but does protect it in the processing of  
> the board,
> and consequently does offer some protection to the end user.  
> Anybody know what
> that is or how I call it out?
>
> -- 
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