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August 2014

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Thu, 7 Aug 2014 12:10:23 -0500
Content-Type:
text/plain
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text/plain (58 lines)
Yes, Chris, come as clean as you can or we'll send Clump/Kloumpios to visit
you.

Dave


On Thu, Aug 7, 2014 at 11:44 AM, Stadem, Richard D. <
[log in to unmask]> wrote:

> Okay, Chris. We've done our WAG speculating. Out with your suspicions, we
> must hear them.
> dean
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
> Sent: Wednesday, August 06, 2014 1:49 PM
> To: [log in to unmask]
> Subject: [TN] SJ fracture signature
>
> We see hundreds of cracked solder joints every year, but I can't say that
> I've ever seen one quite like this.  I have some suspicions, but I'll keep
> them to myself, as to not prejudice the crowd.
> EDS maps are forthcoming.
>
> This is a caught in-the-wild field failure of a 48-pin BGA Reballed to
> SnPb ENIG on board side Ni barrier on component side
>
> http://stevezeva.homestead.com/45268-1.JPG
>
> http://stevezeva.homestead.com/45268-2.JPG
>
> http://stevezeva.homestead.com/45268-8.JPG
>
> Thoughts?  And Thanks to Steve!
>
>
> Chris Mahanna
> President, Technical Manager
> Robisan Laboratory Inc.
>
>
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