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August 2014

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 7 Aug 2014 16:44:27 +0000
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Okay, Chris. We've done our WAG speculating. Out with your suspicions, we must hear them.
dean

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Wednesday, August 06, 2014 1:49 PM
To: [log in to unmask]
Subject: [TN] SJ fracture signature

We see hundreds of cracked solder joints every year, but I can't say that I've ever seen one quite like this.  I have some suspicions, but I'll keep them to myself, as to not prejudice the crowd.
EDS maps are forthcoming.

This is a caught in-the-wild field failure of a 48-pin BGA Reballed to SnPb ENIG on board side Ni barrier on component side

http://stevezeva.homestead.com/45268-1.JPG

http://stevezeva.homestead.com/45268-2.JPG

http://stevezeva.homestead.com/45268-8.JPG

Thoughts?  And Thanks to Steve!


Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.


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