IPC-600 3.2 is used primarily to show what the results and shapes of etched traces will be using various resist methods.

From a fabricator's standpoint, it depends on the Chemistry and process they use.

From a design/customer standpoint, it is always best to allow the fabricator to "add" the etch factor to fabrication files. A designer/ customer should be, however, aware of etch factor ranges so the initial designs leave enough room to allow for it. In general, I believe most fabricators will be around .001" per oz. weight copper (or less). This means an etched line on 1 oz. copper will end up .001" narrower than the file used to create the etched line.

I hope this helps.

Mike Lehmicke
Project Engineer
Printed Circuit Products
Molex Incorporated
22 Empire Drive
St. Paul, MN 55103
651-846-7728
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mordechai Kirshenbaum
Sent: Thursday, August 07, 2014 10:26 AM
To: [log in to unmask]
Subject: [TN] Minimum allowed Etch Factor

Dear Sir

Dear Sir

Is there a criteria or a  requirement for the minimum allowed "etch factor”
i.e. the ratio of the depth of etch to the amount of lateral etch as defined by # 3.2 of IPC-A-600
and depicted in fig  IPC-600g-321a.

Mordechai

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