Subject: | |
From: | |
Reply To: | |
Date: | Fri, 8 Aug 2014 14:03:18 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
We've seen solder wicking through 12 mil vias on thin, ~25 mil, boards.
Dick Krug, CSSBB, CSMTPE
Lead Process Engineer
Sparton Brooksville, LLC
30167 Power Line Road
Brooksville, FL 34602-8299
p (352) 540-4012 (Internal Ext. 2012)
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nagaraj Shanmugam
Sent: Friday, August 08, 2014 7:59 AM
To: [log in to unmask]
Subject: [TN] via in pad solder wicking Vs drill size
Hello All,
Bring back an old topic for clarification and seeking more details on this.
Few application note says that the solder wicking is not seen when the through hole via drill size is kept equal to 0.3mm(0.012") or less Few application note recommend to fill the vias used on Thermal pad on QFN devices - epoxy or capping on all via sizes.
Please advise is solder wicking do happen on through hole via drill size 0.3mm(0.012") or less? i.e. solder wicking Vs the via drill size Is this applicable to passive parts using Though via in pad? Because I see the pad area Vs solder quantity difference between a thermal pad and a passive component pad.
Appreciate any information on this topic.
Thanks,
Nagaraj.
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|