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July 2014

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 9 Jul 2014 17:43:47 +0000
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I was just about to respond with the words "

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, July 09, 2014 12:30 PM
To: [log in to unmask]
Subject: Re: [TN] HASL Plated PCB Matter

Hi Ricardo,

I finally have your pictures posted. Sorry it took me so long, I can usually post things much sooner than this, but I was tied-up all day with jury duty yesterday, and when I came into work today it's been hectic.

So here are your photos:

http://stevezeva.homestead.com/HASL1.jpg

http://stevezeva.homestead.com/HASL2.jpg

To me, this looks pretty typical of the HASL that I see, you don't ever get perfectly flat pads with HASL.

Steve 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo Moncaglieri
Sent: Tuesday, July 8, 2014 10:16 AM
To: [log in to unmask]
Subject: [TN] HASL Plated PCB Matter

Dear Colleagues,
I´m working in the aerospace industry at INVAP SE - ARGENTINA and my rol is QA Electronic Service Manager.
Would like to know your comments on following matter:
 
Have requested to a new PCB provider some HASL plated pcb specimens in order to verify its quality and found out what enclosed pictures show:
100% of plated pads have its plating drained or slided off toward the same direction from left to right affecting coplanarity.
As per our visual inspection at first conclusion we stated that it is an Indicator Process (not necessary dewetting related issue) and could be caused between others, from:
1) Pb % degraded.
2) Low air flow temperature trend.
3) Angle of impact of air flow.
 
We asked the provider to define cause of this issue. We didnt do a metallographic analisys to verify Cu6Sn5 presence to confirm intermetallic fusion.
 
We run the J-STD-003 test "C" to verify solderability and it is 100% Ok well wetted, furthermore we soldered a desoldering ribbon (previously tin plated) directly to a pad without using of Flux nor solder and verified that its adherence is very good which indicates pad surface would be well plated.
 
As per your experience: Do you agree with us on our conclusions specially that it seems to be not a strictly dewetting matter?
 
Appreciate too much your feedback on such a matter.
 
Brgds, Ricardo Moncaglieri





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