Steven,

Via fill is needed in components such as BGAs in order to prevent solder
balls created during the reflow soldering process.
Via fill also prevent process materials residues left inside the via holes/


On Tue, Jul 8, 2014 at 11:57 PM, Steven Kelly <[log in to unmask]> wrote:

> Hi All,
> What is the rationale/reasoning behind via fill on inner layers.
> Selective via fill - how painful is this .
>
> Thanks in advance.
>
> Regards Steve Kelly
>
> Phone(O) (416) 750-8433
> Phone (C) (416) 577-8433
>
> If the recipient to whom this e-mail is sent has an NDA with PFC Flexible
> Circuits Limited this e-mail is considered confidential and is subject to
> any NDA agreements between the respective parties.
>
> See PFC on "How its' Made" in Canada on July 7th at 8 p.m. on the
> Discovery Channel
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>



-- 

Best Regards,

*Reuven Rokah*

Mobile: 972-52-6012018
Tel:        972-3-9360688
Fax:          076-5100674
 <http://www.rokah-technologies.com/>[log in to unmask]
[log in to unmask]
www.rokah-technologies.com


This e-mail message is intended for the recipient only and contains
information which is CONFIDENTIAL and which may be proprietary of Rokah
Technologies. If you have received this transmission in error, please
inform me by e-mail, phone or fax, and then please delete all of the
original files and all other copies exist.


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________