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July 2014

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Subject:
From:
Robert Kondner <[log in to unmask]>
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Date:
Tue, 29 Jul 2014 12:40:19 -0400
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Opps,

 Duh, ok, my eye took those as vias but obviously now I can see some are too
close to each other and some are too small. 

 Sorry,
Bob K

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Foster
Sent: Tuesday, July 29, 2014 12:13 PM
To: [log in to unmask]
Subject: [TN] Trying to figure out possible mechanism for contamination

We have been seeing a problem recently on several different CCA'S that we
are having assembled.
The boards are ENIG with plug and plate.  The assembly shop is assuring us
that these gold areas are being Protected during the entire assembly process
with kapton tape.
I was thinking it was flux splatter since the areas are always almost
perfectly circular.
The locations are very random and range from nothing to what is in the
picture.
Is there any other mechanism that might be causing this? On our next run I
am going to go to the shop To witness the taping. But I was curious if maybe
it's some other cause.
Mr. Gregory was kind enough to post a picture.
http://stevezeva.homestead.com/spots.jpg

Any thoughts would be appreciated
Thank You
John Foster
L3 Communicatons

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