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July 2014

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Fri, 25 Jul 2014 17:49:07 -0400
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agree with robert.  switch fabric best done by FPGA.  based on your  
usage of conductive ink, it can't be high voltage...
http://www.eetimes.com/document.asp?doc_id=1279061
something like this?
    jk
On Jul 25, 2014, at 12:50 PM, Ofer Cohen wrote:

> Hello, Technetters,
> It is 8 years since I left the listserv and moved to another job  
> and company. I'm returning now in quality position for a company  
> that works in the security domain. I somewhat lost the touch, but  
> hope to resharpen ASAP. I glad to see here the old known names,  
> from whom I learned a lot then, and hope to continue to learn.
>
> I have a question regarding printable circuit: our products are ver  
> complex and have many IO options. Currently we are usig 0 ohms  
> resistors and resistor networks to switch the proper IO to the  
> card's connectors. But the complexith of the cards rises, there are  
> more and more options, and the real estate needed for the resistors  
> becomes expensive. Due to some restrictions we are using resistors  
> size to 0402, not smaller.
>
> There was an idea to route all the signals to a single BGA-like  
> footprint, and print the configuration using conductive ink. The  
> ink should be applied before the reflow, because otherwise we  
> should prepare 3D stamp rather than some kind of flat stencil.
>
> Did any of you expertienced such solution? If yes - can you refer  
> me to materials, processes, etc? The product shold be functional in  
> wide temperature range - -40 to +120 deg C. It will be protected  
> with conformal coating.
>
> Regards
> Ofer Cohen


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