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July 2014

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Thu, 17 Jul 2014 06:34:15 -0400
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text/plain
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Gurus,
The most challenge in my short career of 24 years is application of  
thermal components:  the requirements just go up non stop.  How do  
you handle the thermal load in terms of static,  dynamic or transient  
thermal load on high density PWB/PWA, besides known build in heat  
sink.  I am seeking for the low provide conduction type, with limited  
or no convection cooling.  Many thanks.
(IBM's metal backing PWB is nice, but for multi-layer, >8 is a bit  
difficult. Besides, double side or high density might have some  
limitation - any new development in the field? )
Thanks in advance. (net a bit quiet, I guess many on summer vacation  
mode with BBQ  ;-).
             joyce


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