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Date: | Wed, 9 Jul 2014 14:00:09 -0400 |
Content-Type: | text/plain |
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unless, you stamp it while hot - not everybody"s cup of tea. your
vendor most likely not going to do it, even you pay them more.
jk
On Jul 9, 2014, at 1:29 PM, Steve Gregory wrote:
> Hi Ricardo,
>
> I finally have your pictures posted. Sorry it took me so long, I
> can usually post things much sooner than this, but I was tied-up
> all day with jury duty yesterday, and when I came into work today
> it's been hectic.
>
> So here are your photos:
>
> http://stevezeva.homestead.com/HASL1.jpg
>
> http://stevezeva.homestead.com/HASL2.jpg
>
> To me, this looks pretty typical of the HASL that I see, you don't
> ever get perfectly flat pads with HASL.
>
> Steve
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo
> Moncaglieri
> Sent: Tuesday, July 8, 2014 10:16 AM
> To: [log in to unmask]
> Subject: [TN] HASL Plated PCB Matter
>
> Dear Colleagues,
> I´m working in the aerospace industry at INVAP SE - ARGENTINA and
> my rol is QA Electronic Service Manager.
> Would like to know your comments on following matter:
>
> Have requested to a new PCB provider some HASL plated pcb specimens
> in order to verify its quality and found out what enclosed pictures
> show:
> 100% of plated pads have its plating drained or slided off toward
> the same direction from left to right affecting coplanarity.
> As per our visual inspection at first conclusion we stated that it
> is an Indicator Process (not necessary dewetting related issue) and
> could be caused between others, from:
> 1) Pb % degraded.
> 2) Low air flow temperature trend.
> 3) Angle of impact of air flow.
>
> We asked the provider to define cause of this issue. We didnt do a
> metallographic analisys to verify Cu6Sn5 presence to confirm
> intermetallic fusion.
>
> We run the J-STD-003 test "C" to verify solderability and it is
> 100% Ok well wetted, furthermore we soldered a desoldering ribbon
> (previously tin plated) directly to a pad without using of Flux nor
> solder and verified that its adherence is very good which indicates
> pad surface would be well plated.
>
> As per your experience: Do you agree with us on our conclusions
> specially that it seems to be not a strictly dewetting matter?
>
> Appreciate too much your feedback on such a matter.
>
> Brgds, Ricardo Moncaglieri
>
>
>
>
>
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