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Date: | Tue, 29 Jul 2014 13:08:24 -0400 |
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SEM/EDX analysis of those spots? if it is Sn - you got melt solder
balls (mis-screened panel after wash got residue left on the gold),
if you see Nickel, you got plating defect (the dark spot in the
middle might have a clue - bubbles due to residue oxide or something
like that). pure guess. you need FA. IMO.
jk
On Jul 29, 2014, at 12:12 PM, John Foster wrote:
> We have been seeing a problem recently on several different CCA'S
> that we are having assembled.
> The boards are ENIG with plug and plate. The assembly shop is
> assuring us that these gold areas are being
> Protected during the entire assembly process with kapton tape.
> I was thinking it was flux splatter since the areas are always
> almost perfectly circular.
> The locations are very random and range from nothing to what is in
> the picture.
> Is there any other mechanism that might be causing this? On our
> next run I am going to go to the shop
> To witness the taping. But I was curious if maybe it's some other
> cause.
> Mr. Gregory was kind enough to post a picture.
> http://stevezeva.homestead.com/spots.jpg
>
> Any thoughts would be appreciated
> Thank You
> John Foster
> L3 Communicatons
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