TECHNET Archives

July 2014

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
TechNet E-Mail Forum <[log in to unmask]>, Peter Wong <[log in to unmask]>
Date:
Tue, 8 Jul 2014 15:51:05 -0500
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Larry Dzaugis <[log in to unmask]>
Subject:
Re: Dissolving pins
From:
Larry Dzaugis <[log in to unmask]>
Message-ID:
<[log in to unmask]>
In-Reply-To:
<[log in to unmask]>
Content-Type:
text/plain; charset="UTF-8"
MIME-Version:
1.0
Parts/Attachments:
text/plain (12 lines) 
SAC305 will dissolve pins, solder pots, tools.

The material does not melt but is pulled into the tin rich solder.
I had 1/4 inch tooling plates almost errode through and solder pot weld
points fail.


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2