 
| Sender: |
|
| X-To: |
|
| Date: |
Thu, 17 Jul 2014 06:34:15 -0400 |
| Reply-To: |
|
| Message-ID: |
|
| Subject: |
|
| From: |
|
| Content-Transfer-Encoding: |
7bit |
| In-Reply-To: |
|
| Content-Type: |
text/plain; charset="US-ASCII"; delsp=yes; format=flowed |
| MIME-Version: |
1.0 (Apple Message framework v753.1) |
| Parts/Attachments: |
|
|
Gurus,
The most challenge in my short career of 24 years is application of
thermal components: the requirements just go up non stop. How do
you handle the thermal load in terms of static, dynamic or transient
thermal load on high density PWB/PWA, besides known build in heat
sink. I am seeking for the low provide conduction type, with limited
or no convection cooling. Many thanks.
(IBM's metal backing PWB is nice, but for multi-layer, >8 is a bit
difficult. Besides, double side or high density might have some
limitation - any new development in the field? )
Thanks in advance. (net a bit quiet, I guess many on summer vacation
mode with BBQ ;-).
joyce
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|
