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June 2014

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Subject:
From:
Zilber Gil <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Zilber Gil <[log in to unmask]>
Date:
Mon, 2 Jun 2014 19:14:20 +0000
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Thanks Ioan,
To be correct the reflow setting is between 217 to 225. I preffer to be on the upper side of the process window to cover both reflow process to gold and lead free component finish. The board finish is SnPb HASL. The board material can be reflowed at lead free temperature.
We did not see such behevior on other same size capacitures. My guess is that due to surface porosity of the capaciture it acts like a desoldering braid. Could it be?
Thanks.
Gil


-------- הודעה מקורית --------
מאת: Ioan TEMPEA
תאריך:02/06/2014 8:15 PM (GMT+02:00)
אל: TechNet E-Mail Forum ,Zilber Gil
נושא: RE: Capacitor - strange soldering behavior

Hi Gil,

Why was SnPb soldered at 225 C, per your e-mail, or 230 C per your photo album? In SnPb products, you just need to reach 203 C and if the cap is SnPb, why would you solder it using near Pb free temperatures as the product will not be RoHS compliant anyways? Depending on the quality of the PCB, at 230 C you might even degrade the PCB and, eventually, compromise the pad solderability, with solder going up the component. What finish you have on the pads? Immersion Sn might heavily degrade at high temps.

Also, remember, the molten solder goes towards the high heat. If the pads are connected to ground planes, the capacitor will be hotter and the solder will go up its terminations.

It's not once that I had to prevent solder from going uphill by using lower settings on the topside heaters of the oven and higher on the bottom ones.

Ioan Tempea


-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Zilber Gil
Envoyé : Thursday, May 29, 2014 10:02 AM
À : [log in to unmask]
Objet : [TN] Capacitor - strange soldering behavior

Hello Technet,

While soldering this ceramic capacitor (http://ipc-technet.groupsite.com/gallery/27235), its looks like that the capacitor suck the solder from the PCB`s pad to the capacitor pad and the color is now grayish and porosity. XRF found Sn, Pb, Cu on the capacitor pad. PCB solderability was good and the profile was SnPb at 225 deg C under Nitrogen. Other capacitors and components on the board look normal with shine soldering.
Can anybody seen something like that before? Any ideas?

Thanks and have a wonderful weekend.

Dr. Gil Zilber
Technologist, Elta system Ltd.


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