As far as PWB goes it has to be polyimide material (Tg 260) to withstand the harsh environment. I am not aware of other options for down hole application.
Best regards,
Jason Zhao
VP of North America Operations
Sunshine Global PCB Group
US Cell 510-468-4412, China Cell 131-62722392
High Mix, High Tech, Low-Mid Volume PCB Manufacturer
www.sunshinepcbgroup.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Thursday, June 05, 2014 8:55 AM
To: [log in to unmask]
Subject: Re: [TN] high temp environment
To clarify - the proposed project is one we will build, we are not involved in the design other than performing manufacturability reviews on it. Our part is looking like assembly of the circuit board and potentially potting the board into it's carrier. The client is well versed in the design side of things.
regards,
Graham Collins
Senior Process Engineer
Sunsel Systems
(902) 444-7867 ext 211
On 6/5/2014 10:38 AM, Brian Ellis wrote:
> Absolutely, the only sensible approach!
>
> Beian
>
> On 05.06.2014 16:13, Steven Creswick wrote:
>> Graham,
>>
>> Back in the day, we would have approached as much as we could with
>> hybrid technology.
>>
>> Eutectic die attach on ceramic [High temp co-fired ceramic, alumina
>> substrate within metal package, or Low Temp Co-fired ceramic], etc.
>> Way back, there was even eutectic attach for passives - if properly
>> metallized...
>>
>> Being in a hermetic package, no conformal coatings...
>>
>> Being a potentially highly corrosive environment the package is truly
>> put to the test. Drawing upon implantable medical technologies [also
>> a corrosive environment, believe it or not], there are multiple
>> packaging options available including stainless & titanium.
>>
>> Just a different persective...
>>
>> Steve Creswick
>> Sr Associate - Balanced Enterprise Solutions
>> http://www.linkedin.com/in/stevencreswick
>> 616 834 1883
>>
>>
>>
>>
>>
>>
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