To clarify - the proposed project is one we will build, we are not 
involved in the design other than performing manufacturability reviews 
on it.  Our part is looking like assembly of the circuit board and 
potentially potting the board into it's carrier.  The client is well 
versed in the design side of things.

regards,

Graham Collins
Senior Process Engineer
Sunsel Systems
(902) 444-7867 ext 211

On 6/5/2014 10:38 AM, Brian Ellis wrote:
> Absolutely, the only sensible approach!
>
> Beian
>
> On 05.06.2014 16:13, Steven Creswick wrote:
>> Graham,
>>
>> Back in the day, we would have approached as much as we could with 
>> hybrid
>> technology.
>>
>> Eutectic die attach on ceramic [High temp co-fired ceramic, alumina
>> substrate within metal package, or Low Temp Co-fired ceramic], etc.  Way
>> back, there was even eutectic attach for passives - if properly
>> metallized...
>>
>> Being in a hermetic package, no conformal coatings...
>>
>> Being a potentially highly corrosive environment the package is truly 
>> put to
>> the test.  Drawing upon implantable medical technologies [also a 
>> corrosive
>> environment, believe it or not], there are multiple packaging options
>> available including stainless & titanium.
>>
>> Just a different persective...
>>
>> Steve Creswick
>> Sr Associate - Balanced Enterprise Solutions
>> http://www.linkedin.com/in/stevencreswick
>>                           616 834 1883
>>
>>
>>
>>
>>
>>
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