Absolutely, the only sensible approach!

Beian

On 05.06.2014 16:13, Steven Creswick wrote:
> Graham,
>
> Back in the day, we would have approached as much as we could with hybrid
> technology.
>
> Eutectic die attach on ceramic [High temp co-fired ceramic, alumina
> substrate within metal package, or Low Temp Co-fired ceramic], etc.  Way
> back, there was even eutectic attach for passives - if properly
> metallized...
>
> Being in a hermetic package, no conformal coatings...
>
> Being a potentially highly corrosive environment the package is truly put to
> the test.  Drawing upon implantable medical technologies [also a corrosive
> environment, believe it or not], there are multiple packaging options
> available including stainless & titanium.
>
> Just a different persective...
>
> Steve Creswick
> Sr Associate - Balanced Enterprise Solutions
> http://www.linkedin.com/in/stevencreswick
>                           616 834 1883
>
>
>
>
>
>
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