Hi Dave,
I did not cross section the capacitor, I will do it next week and update you, also will check the underlying metallization,I did not find it on the datasheet.

Thanks,

Gil

________________________________
From: David Hillman [mailto:[log in to unmask]]
Sent: Monday, June 02, 2014 5:36 PM
To: TechNet E-Mail Forum; Zilber Gil
Subject: Re: [TN] Capacitor - strange soldering behavior

Hi Gil - two questions: (1) Does the capacitor have a barrier layer of copper or nickel to prevent the underlying metallization from leaching into the solder joint?; (2) Have you completed a cross section to assess the solder joint microstructure?

Dave Hillman
Rockwell Collins
[log in to unmask]<mailto:[log in to unmask]>


On Thu, May 29, 2014 at 9:01 AM, Zilber Gil <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hello Technet,

While soldering this ceramic capacitor (http://ipc-technet.groupsite.com/gallery/27235), its looks like that the capacitor suck the solder from the PCB`s pad to the capacitor pad and the color is now grayish and porosity. XRF found Sn, Pb, Cu on the capacitor pad. PCB solderability was good and the profile was SnPb at 225 deg C under Nitrogen. Other capacitors and components on the board look normal with shine soldering.
Can anybody seen something like that before? Any ideas?

Thanks and have a wonderful weekend.

Dr. Gil Zilber
Technologist, Elta system Ltd.


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